Method of manufacturing semiconductor package and its package

It provide a manufacturing method that can suppress die shift

Overview

　The Fan-out Wafer Level Package (FOWLP) method, which is the mainstream method for semiconductor packages, especially for mobile applications, has a problem of "die shift" in which mounted components shift by flow of sealing resin and wiring defects occurred. Further, even in a device such as a flexible display, there is a problem that a mounted component on the device is shifted when the device is bent.　
　In order to solve the above problems, the invention is a method of manufacturing a semiconductor package without die shift by incorporating a special anchor layer under a mounting component and adopting a special manufacturing process, and the semiconductor package.
　The invention is expected to produce a highly integrated semiconductor package without a die shift, and to be applied to a flexible display and a wearable device.

Features・Outstandings

Product Application

・μ-LED Flexible Display　
・Semiconductor package for flexible wearable device

Related Works

[1] T. Fukushima et al., IEEE Transactions on Components,Packaging and Manufacturing Technology, vol. 10, no. 8, pp.1419-1422, Aug. 2020

IP Data

IP No.　 ： WO/2022/025214 　
Inventor ： FUKUSHIMA Takafumi, TANAKA Toru, KINO Hisashi, SUSUMAGO Yuki
keyword ： semiconductor packages, die shift, flexible